US Patent No. 5,572,434
METHOD FOR SIMULATING MOLD FILLING OF SEMI-SOLID MATERIAL
Issued: November 5, 1996
Inventor: Kuo K. Wang, Shau-poh Wang, both of Ithaca, New York
Assignee: Cornell Research Foundation, Inc., Thornwood Drive, Ithaca, NY 14850
An efficient numerical procedure for the simulation of Newtonian fluids with non-negligible inertial effect which satisfies the Navier-Stokes equations and the energy equation. The method simulates the molding-filling process of incompressible viscous liquid, e.g. semi-solid metal, in a thin and irregular cavity. The moving free surfaces in an irregular domain is tracked using a fixed-mesh method. The material discontinuities across the interface between air and the liquid are removed by replacing the air with a pseudo-gas which has small density and dynamic viscosity but its kinematic viscosity is the same as that of the liquid. During the filling process, the (semi-solid) liquid may solidify on the mold surface. As a result, the effective cavity thickness reduces non-uniformly according to the result thermal analysis. The Navier-Stokes equations are integrated across the remaining gap by assuming that the velocity profile (not magnitude) is similar to that in a fully-developed flow. The method incorporates general viscosity and solidification models to simulate the filling and solidification processes for the injection molding of Semi-Solid Metal in a two-dimensional thin cavity. The predictions have been compared with experimental results. The simulation results showed not only good agreement with the experiments but also helped explain the flow marks observed on the surface and the phase segregation in the cross section of a rheomolded spiral part.
Go Back for more representative patents.
Home || Intellectual Property || Patents || Trademarks || Copyrights
Brown & Michaels, PC
400 M & T Bank Building
118 North Tioga Street - The Commons
Ithaca, NY 14850
Phone: (607) 256-2000 · Fax: (607) 273-2609
- last updated 12-Apr-02
© Copyright 2002 Brown & Michaels, PC