Reconfigurable modular microfluidic system and method of fabrication
Patent No. 7,011,793
Issued: March 14, 2006
Inventors: Zhou; Peng (Newtown, PA); Young; Lincoln (Ithaca, NY)
A reconfigurable modular microfluidic system, providing a microfluidic breadboard platform for the formation of fluidic network and fluidic sealing upon a system assembly. Modular microfluidic elements or "chips" are arranged on a precisely machined alignment base to form a fluidic network, with fluid connections provided directly from chip-to-chip at overlapping corners. Fluidic access to external devices is possible at every fluid connection and through special ingress/egress chips. By maintaining a largely planar layout, optical access is provided for detecting or visualization for every chip. The assembly may be covered by a perforated cover plate.
REFERENCE TO RELATED APPLICATIONS
This application claims an invention which was disclosed in Provisional Application No. 60/470,760, filed May 15, 2003, entitled "RECONFIGURABLE MODULAR MICROFLUIDIC SYSTEM AND METHOD OF FABRICATION". The benefit under 35 USC § 119(e) of the United States provisional application is hereby claimed, and the aforementioned application is hereby incorporated herein by reference.
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