Reconfigurable modular microfluidic system and method of fabrication

Patent No. 7,011,793

Issued: March 14, 2006
Filed: 

Inventors: Zhou; Peng (Newtown, PA); Young; Lincoln (Ithaca, NY)
Assignee: Kionix, Inc. (Ithaca, NY)


A reconfigurable modular microfluidic system, providing a microfluidic breadboard platform for the formation of fluidic network and fluidic sealing upon a system assembly. Modular microfluidic elements or "chips" are arranged on a precisely machined alignment base to form a fluidic network, with fluid connections provided directly from chip-to-chip at overlapping corners. Fluidic access to external devices is possible at every fluid connection and through special ingress/egress chips. By maintaining a largely planar layout, optical access is provided for detecting or visualization for every chip. The assembly may be covered by a perforated cover plate.

REFERENCE TO RELATED APPLICATIONS

This application claims an invention which was disclosed in Provisional Application No. 60/470,760, filed May 15, 2003, entitled "RECONFIGURABLE MODULAR MICROFLUIDIC SYSTEM AND METHOD OF FABRICATION". The benefit under 35 USC 119(e) of the United States provisional application is hereby claimed, and the aforementioned application is hereby incorporated herein by reference.


Go Back for more representative patents.


Home || Intellectual Property || Patents || Trademarks || Copyrights


Brown & Michaels, PC
400 M & T Bank Building
118 North Tioga Street - The Commons
Ithaca, NY 14850
Phone: (607) 256-2000 Fax: (607) 256-3628

e-mail: bpm@bpmlegal.com

© 2006 Brown & Michaels PC